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Introduction:
What is GOB packaging technology?
GOB, known as glue on the board, is a special encapsulation method for LED display. Simply put, it is the LED lamp beads fixed in the PCB (printed circuit board), using a special optical thermal conductivity nano-glue filler material to fill the gap between the lamp beads, forming a tightly connected and highly protective whole.
Through the panelized packaging of LED display modules, it comprehensively solves the pain points of SMD products, such as easily falling beads, single pixel particle display, uneven light emission and low protection level. To create a product with high protection, high reliability, excellent display effect, healthy eye protection and other characteristics.
GOB packaging technology principle
Imagine, the traditional LED display is like a night sky composed of countless scattered stars, although bright, but easy to lose light. GOB packaging technology is like a bridge between these stars and a transparent protective film to wrap them tightly. This protective film not only enhances the stability of the connection between stars, but also gives them the ability to resist external aggression. Specifically, the GOB encapsulation technology is implemented in the following steps.
Fixing: First, fix the LED beads precisely on the PCB board.
Gluing: Then, special optical thermal conductive nano-grade gluing material is used to fill the gaps between the light beads. This material not only has good thermal conductivity, but also ensures that the surface is flat and smooth after gluing.
Curing: Finally, by heating or other means, the potting material is cured to form a solid protective layer.
Characteristics of GOB packaging technology
Super stability
The glue filling material tightly fills the gap of the LED lamp bead, which greatly enhances the connection strength between the lamp bead and the PCB board, and reduces the risk of the lamp bead falling off.
Comprehensive protection
GOB encapsulation technology provides comprehensive protection for LED displays, including waterproof, moisture-proof, dust-proof, anti-collision, anti-static and other functions. This high degree of protection allows the LED display to operate stably in a variety of harsh environments.
Excellent optical performance
Special optical thermal conductivity nano-grade potting material not only does not affect the luminous effect of the LED lamp beads, but also helps the uniform diffusion of light and soft processing, making the picture more clear and transparent, fuller and more natural colors.
Efficient heat dissipation
The potting material has good thermal conductivity, which can quickly dissipate the heat generated by the LED light beads and reduce the working temperature of the light beads, thus prolonging their service life.
Advantages of GOB packaging technology
Process advantage
Advanced VMD vacuum encapsulation process: The resin completely covers the pixel light source and tightly fits to the PCB to ensure module flatness and uniformity. No modularity, yin and yang surfaces, flowery screen, splice seam interference, color difference, pockmarks, and a host of pain points.
Large panel package: The physical seam of the display is halved, and at the same time, it realizes the conversion of surface light source. Uniform and soft luminescence, wide viewing angle, high contrast, greatly eliminate moiré, reduce glare and blinding, and alleviate visual fatigue.
Material advantage
The new polymer resin material is characterized by high transmittance (95% ± 2%), strong weather resistance, low stress, strong physical and mechanical properties, and excellent process operability.
Display advantages
Healthy eye protection: Matte surface treatment technology reduces ambient light reflection and glare, reduces glare and relieves visual fatigue.
Fearless shooting: Surface light source effectively eliminates moiré, excellent shooting effect.
Excellent touch: Smooth touch, eliminating the sense of touch particles in human-computer interaction. It is also easy to clean and maintain.
High protection
Moisture proof, waterproof, dustproof: Fully encapsulated with unique VMD technology. The lamp surface protection level is up to IP65, which can be cleaned and maintained directly without mask protection.
Impact Resistance: Can withstand 25Kg/cm² impact force, effectively avoiding the transportation, installation and use of the product damage from the lamp.
Anti-oxidation, UV resistance: advanced VMD encapsulation technology, airtight, effectively isolates the external environment.
Application areas of GOB packaging technology
With the continuous maturity of the technology and the continuous expansion of the application field, GOB packaging technology LED display has been widely used in many fields. For example:
Commercial advertising: High definition and stability make it the first choice for outdoor large screen advertising and indoor LED display in shopping malls.
Stage rental: In concerts, exhibitions and other activities, GOB packaging technology LED display can withstand a variety of complex environments and frequent disassembly and installation needs.
Security Monitoring: High reliability and stability make GOB packaging technology LED display become an important equipment in the field of security monitoring.
Smart Home: With the development of smart home, GOB packaging technology LED display is also gradually used in home theater, intelligent lighting and other fields.
Conclusion
As an important innovation in the field of LED display, GOB encapsulation technology is changing our visual experience with its unique advantages and broad application prospects. It is like a silent guardian warrior for the LED display to provide indestructible protection at the same time and also bring more color and vitality to our life. As technology and application areas continue to expand, I believe GOB packaging technology will play a more important role in creating a better visual world for us in the future.