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Introduction
At this stage, there are many production and packaging processes in the LED display industry. From the previous in-line (LAMP) process, to the surface mount (SMD) process, to the emergence of COB packaging technology, and finally to the emergence of GOB packaging technology. With the emergence of GOB packaging technology, the application field of LED display products will be further expanded. What will the future market development of GOB show? Let’s find out!
What is COB packaging technology?
Chip on Board is called COB for short. COB packaging refers to the way it directly adheres the chip to the PCB substrate for electrical connection. Its main purpose is to solve the heat dissipation problem of LED displays. Compared to in-line and SMD, it is characterized by saving space, simplifying packaging operations, and having efficient thermal management methods. At present, COB packaging is mainly used in some small-pitch products.
What are the advantages of COB packaging technology?
Ultra thin and light
According to the actual needs of customers, PCB boards with thicknesses from 0.4 to 1.2mm can be used to reduce weight to at least one-third of the original traditional products, which can significantly reduce structural, transportation and engineering costs for customers.
Collision and compression resistance
The COB LED display is directly packaged in the concave position of the PCB board, and then packaged and cured with epoxy resin glue. The surface of the light spot is raised to a starting surface, which is smooth and hard, and resistant to collision and wear.
Wide view
The COB package uses shallow well spherical luminescence, with a viewing angle greater than 175 degrees and close to 180 degrees, and has a better optical diffuse color and muddy light effect.
Strong heat dissipation capacity
COB products package the lamp on the PCB board, and quickly transfer the heat of the wick through the copper foil on the PCB board. Moreover, the thickness of the copper foil on the PCB board has strict process requirements. Coupled with the gold deposition process, it will hardly cause serious light decay. Therefore, there are few dead lights, which greatly prolongs life.
Wear-resistant and easy to clean
The surface of the lamp spot is raised into a spherical surface, which is smooth and hard, resistant to collision and wear; if there is a bad spot, it can be repaired point by point; No mask, it can be cleaned with water or cloth if there is dust.
All-weather excellent features
Adopting triple protection treatment, waterproof, moisture, rot, dust, static electricity, oxidation, ultraviolet effects are outstanding; meet all-weather working conditions, the temperature difference environment from minus 30 degrees to plus 80 degrees can still be used normally.
What is GOB packaging technology?
GOB (Glue on Board) is an epoxy resin for the sealing of SMD displays, which is essentially an improved technology of SMD technology, similar to GOM (Glue On Module). It can provide LED lamp bead protection, add protection in front of the LED module, and achieve waterproof, moisture-proof, anti-impact, dust-proof, anti-static, anti-salt spray, anti-oxidation, anti-blue light and eight other anti-effects.
What are the advantages of GOB packaging technology?
GOB process advantages
It is a highly protective LED display that can achieve eight defenses: waterproof, moisture-proof, collision-proof, dust-proof, anti-corrosion, anti-blue light, anti-salt, and anti-static. And it will not have a harmful effect on heat dissipation and brightness loss. Long-term rigorous tests have shown that the shielding glue even helps to dissipate heat, reducing the necrosis rate of lamp beads and making the screen more stable, thus prolonging the service life. It is widely used in restaurants, hotels, bars and stadiums.
Better display
Through the GOB process, the granular pixels on the surface of the original lamp panel have been transformed into an overall flat lamp panel, achieving a transition from a point light source to a surface light source. The GOB ایل ای ڈی ڈسپلے emits more uniform light, the display effect is clearer and more transparent, and the viewing angle of the product is greatly improved (both horizontal and vertical can reach nearly 180 °), effectively eliminating moiré patterns, significantly improving product contrast, reducing glare and glare, and reducing visual fatigue.
What is the difference between COB and GOB?
The difference between COB and GOB is mainly due to the difference in process. Although the COB package has a flat surface and better protection than the traditional SMD package, the GOB package adds a glue filling process to the screen surface, which makes the stability of the LED lamp beads better, greatly reducing the possibility of falling off the lamp, and the stability is stronger.
Which has the advantage between COB and GOB?
If there is no better standard, COB or GOB, because there are many factors that determine whether a packaging process is good or not. The key is to see which one we value, whether it is the efficiency of LED lamp beads or protection. Therefore, each packaging technology has its advantages and cannot be generalized.
Conclusion
When we actually choose whether to use COB packaging or GOB packaging, we need to consider comprehensive factors such as our own installation environment and running time, and this is also related to cost control and display effect differences. As a professional LED display supplier, we focus on the research, design, manufacturing and sales of LED displays. If you are interested, please contact us today!